Diamond wire drawing die and equipment experienced four generations of change, by original machinery grinding type, efficiency is very low, poor grinding pass of the mold, become now the precise integration of the pressure of the piezoelectric ultrasonic EDM compound processing technology and equipment, performance characteristics for the IT industry and trade of diamond wire drawing die hole with good surface finish. The processing of large aperture polycrystalline diamond mold, with composite EDM, processing efficiency.
So far, diamond wire drawing dies and equipment used to manufacture wire and cable have gone through four generations.
The first generation of mechanical grinding, using mechanical grinding method of manufacturing and maintenance of diamond wire drawing die, the efficiency of this method is very low, grinding out of the mold hole pass, has been rarely used.
The second generation of the electronic tube magnetostrictive type, the electronic tube amplifier to provide electrical signals, through the magnetostrictive transducer into mechanical energy, used to grind diamond mold. The disadvantage of this type of model is that the conversion efficiency of the magnetostrictive transducer is too low, and the cooling water is required to be externally connected to the cooling water. Equipment failure rate is high, the current use of the factory is not much.
The third generation of the transistor piezoelectric type, the power supply of the power supply of the transistor by the piezoelectric ceramic transducer into mechanical vibration, it has the advantage of high piezoelectric ceramic conversion efficiency, and does not require additional cooling system. Equipment to reduce the volume, so far this type of most applications, and gradually replace the old mechanical grinding machine and electronic tube magnetostrictive grinding machine, becoming the mainstream of the mold manufacturing equipment. The disadvantages include: large harmonic distortion of the transistor circuit, the transducer is easy to produce transverse vibration, using this model to make the natural diamond micro hole die, the diamond is easy to break and break, the yield is low. High power transistor output, easy to damage, can not be used to manufacture large diameter polycrystalline diamond drawing die.
The fourth generation of precision integrated piezoelectric ultrasonic EDM compound processing technology and equipment, by the Beijing Institute of electrical processing research and development. Such models using high power top audio integrated circuits, with micro Varitronix spark power through pressure electric ceramic titanium alloy transducer conversion, of diamond wire drawing die of ultrasonic and EDM compound processing. Its characteristics are as ultrasonic signal hi fi amplifier chip, the internal circuits are powerful, including automatic gain control (AGC) circuit, overheat protection circuit, a load short circuit protection circuit, with total harmonic distortion of the advantages of small size, low noise. Titanium alloy transducer has low impedance, high Q value, low internal loss, high mechanical strength, long service life, stable performance and high conversion efficiency. Need a sound circuit and piezoelectric ceramic type titanium alloy transducer combine to produce a very pure in ultrasonic and utterly complex wave and transverse vibration. The diamond wire drawing die with its processing is good, and the surface finish is high. The processing of large aperture polycrystalline diamond mold, with composite EDM, processing efficiency.
The research and development of the fourth generation precision integrated piezoelectric ultrasonic processing machine. Is the first successful development of the Beijing Electric Processing Research Institute at the end of 1991, and quickly applied to the field of diamond wire drawing die manufacture. The first batch of machine models for bdc-50a. The purpose of the research is in order to improve the precision of natural diamond micro aperture mold manufacturing, based roundness and pass accuracy reached a sub micron and surface rough degree reached mirror level.
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